--------- 2021-05-27 16:29:56 ---------
SigmaKey 2.40.09 HiSi: Remove FRP
HUAWEI USB COM 1.0 (COM130), Provider: HUAWEI Incorporated, Driver ver.: 2.0.6.725, Date: 10/08/2014, USB\VID_12D1&PID_3609&REV_0100
HiSilicon: Kirin 985
Phone model: JEF-NX9
Version: JEF-N29 11.0.0.149(C185E4R1P3)
Removing FRP lock...Done
--------- 2021-05-27 16:32:12 ---------
SigmaKey 2.40.09 HiSi: Repair "Chip is damaged"
The phone is NOT connected properly. Read the manual at the official site for details.
--------- 2021-05-27 16:32:19 ---------
SigmaKey 2.40.09 HiSi: Repair "Chip is damaged"
The phone is NOT connected properly. Read the manual at the official site for details.
--------- 2021-05-27 16:39:05 ---------
SigmaKey 2.40.09 HiSi: Repair "Chip is damaged"
HUAWEI USB COM 1.0 (COM130), Provider: HUAWEI Incorporated, Driver ver.: 2.0.6.725, Date: 10/08/2014, USB\VID_12D1&PID_3609&REV_0100
The battery must be connected to the phone's board and fully charged. [YES]
HiSilicon: Kirin 990 (P40/P40 Pro)
Sending boot....Error B00720AA
SigmaKey 2.40.09 HiSi: Remove FRP
HUAWEI USB COM 1.0 (COM130), Provider: HUAWEI Incorporated, Driver ver.: 2.0.6.725, Date: 10/08/2014, USB\VID_12D1&PID_3609&REV_0100
HiSilicon: Kirin 985
Phone model: JEF-NX9
Version: JEF-N29 11.0.0.149(C185E4R1P3)
Removing FRP lock...Done
--------- 2021-05-27 16:32:12 ---------
SigmaKey 2.40.09 HiSi: Repair "Chip is damaged"
The phone is NOT connected properly. Read the manual at the official site for details.
--------- 2021-05-27 16:32:19 ---------
SigmaKey 2.40.09 HiSi: Repair "Chip is damaged"
The phone is NOT connected properly. Read the manual at the official site for details.
--------- 2021-05-27 16:39:05 ---------
SigmaKey 2.40.09 HiSi: Repair "Chip is damaged"
HUAWEI USB COM 1.0 (COM130), Provider: HUAWEI Incorporated, Driver ver.: 2.0.6.725, Date: 10/08/2014, USB\VID_12D1&PID_3609&REV_0100
The battery must be connected to the phone's board and fully charged. [YES]
HiSilicon: Kirin 990 (P40/P40 Pro)
Sending boot....Error B00720AA
Attachments
-
27.2 KB Views: 345